integralCAPSULE by PROOFCAP
PROOFCAP produces custom design capsulation for electronics in sensors, drones, IoT, 5G small cell base stations, power switching devices and more….
integralCAPSULE by PROOFCAP shields electronics in many ways - the capsule is hermetic, lightweight and shields against EMI and RF interference.
integralCAPSULE by PROOFCAP is supplied in sizes from 10x10mm to 250x300mm and manufactured by laminating a copper alloy foil between two thermoplastic films to form a sheet, which is then pressed into the required shape. The capsule halves are delivered to the customer’s factory, where they are joined around the electronics using a patented sealing tool, ensuring robust protection and repeatable quality.
hermetic
Proofcap capsulation has showed to withstand harsh outdoor and urban conditions for 20 years (Testing at SP, Swedish National Testing & Research Institute). The Technology offers a near-hermetic barrier against moisture migration.
The moisture diffusion rate into a Proofcap enclosure is slow, with a time constant of several years.
The rough seas of the Norwegian fjords have proven that Proofcap can withstand constant saltwater exposure under rapid weather and temperature shifts.
lightweight
PROOFCAP shielding saves weight compared to casted aluminium boxes and pottings in epoxies or polyurethane. A 100x100mm cover weighs typically 20 grams.
EMI and RF shielding
integralCAPSULE by PROOFCAP separates different RF functions from each other within the same capsule
Up to 60 dB dampening, or more, has been measured for telecom applications. The Proofcap cover is connected to the PCB with short-circuiting strips and cavities easily formed to separate functions and sectors on the PCB.
The electrical contact between Proofcap cover and PCB as well as metal surfaces are well protected by the melted inner plastic film. This results in long term effective shielding properties. The short circuiting strip is integated in the Proofcap cover and thus reduce the the number of extra items and operations. Conductive gaskets and metal surfaces often detoriate quickly and require correct contact pressure.
cooling plate
integralCAPSULE by PROOFCAP can be designed to integrate a cooling plate with excellent thermal conduction properties
microstrip patch antenna
integralCAPSULE by PROOFCAP can be designed to contain an integrated patch antenna
