Encapsulation of electronics

PROOFCAP encapsulation provides electronics with hermetic, lightweight RF shielding.

Microstrip Patch Antenna can be laminated to the encapsulation.

We call it PROOFCAPsulation.

The PROOFCAP capsule is manufactured by laminating a copper alloy foil between two thermoplastic films into a sheet, pressed to the correct shape and delivered to the customer’s factory where both halves of the capsule are joined together with a special tool around the electronics to be protected.